製品情報
Designable Low CTE/High Power Thermal Conductive Plate
Features
- Thermal conductivity: Approximately 280W / mK
- Coefficient of thermal expansion in the plane direction: 5-10ppm / K
・ Composite material that has both thermal conductivity and low coefficient of thermal expansion
・ Consists of core and core plate
・ Core:A Columnar shape that facilitates heat transfer in the vertically direction to the plate
・ Core plate: A plate for reducing in-plane thermal expansion coefficient