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Micro Channel Heat Exchanger
Liquid Cool Micro Channel Heatsink
Heat exchanger for hydrogen station
Vapor chamber
Diffusion bonding application example
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Core
Thermal One-Stop
Solid phase diffusion bonding
Realization of microchannel structure
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製品情報
"WEL-Cool HeatSink" M2020
Features
Uniform cooling over the entire surface by 3D matrix channel design
Customization is possible. Please contact us.
Cooling area: 20mm x 20mm
Material: Copper
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Micro Channel Heat Exchanger
Liquid Cool Micro Channel Heatsink
Heat exchanger for hydrogen station
Vapor chamber
Diffusion bonding application example
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